WSB自動粘片機簡介：
The Logitech WSB unit offer premium bonding for the processing of fragile semiconductor wafers such as Silicon and Gallium Arsenide.

The bonding unit is designed to minimise breakage with these expensive materials, whilst retaining the highest quality of sample yield.

WSB自動粘片機特點：

• Automated process cycle

• Excellent wafer to support disc parallelism

• Process Repeatability

• 4" or 6" wafer capacity

• Single or multiple wafer bonding

Logitech WSB單元為硅和砷化鎵等易碎半導體晶片的加工提供優(yōu)質(zhì)的鍵合。粘合單元的設計旨在大程度地減少這些昂貴材料的斷裂，同時保持最高質(zhì)量的樣品產(chǎn)量。

自動粘片機特點：
•自動化流程循環(huán)

•出色的晶圓支持光盤平行度

•過程重復性

•4英寸或6英寸晶圓容量

•單晶圓或多晶圓鍵合